![]() ![]() Activating this will open de over door after te hold time of the reflow temperature is over, thus allowing to cool down immediately after soldering. Zone temperature, hold time, active or not.If you click on the save button, you can edit the profile in the profile editing menu.These profiles can also be used as template to specify your own curve. In this window you can see the 9 predefined soldering profiles. We deliver the eC-reflow-pilot software including some predefined solder profiles.Due to the double level built drawer, the PCB will not move as it sits on the top level of the drawer, if the drawer is opened while using the hood. Setting the door open point at 215☌ will make sure that the oven opens up fast enough so cooling can take place quicker. The set dwell time of 10 seconds will exceed 30 seconds, which should be enough for any standard technique. To be sure of the latter, you could still activate T ramp, but that usually has no effect because the oven is slower than the built in security value of not reaching 190☌ within 3 minutes. Due to the enormously good thermal insulated eC-reflow-mate-V4, the effect of the Thermal Inertia, will make sure that heat up times are well under the maximum defined ramp up times. This curve will take the board straight to the reflow temperature and hold it for at least 10 seconds. Since soldering with any chamber reflow oven is very much affected by Thermal Inertia, we recommend to make the curve as simple as possible and to start your reflow experience with a simply 2 point curve: Reflow (245☌, 10 seconds) and Door Open (215☌ with Hood).You can define up to 5 of these points (3 preheat, 1 reflow and 1 doors open point). Since this is very hard to get under control we opted to pilot the oven based on temperature set points and hold times at this specific temperature set point. ![]() This time required depends on size of the board, on copper load, solder mask colour, component load and size, etc… some experience will be required to estimate this for your board. therefore our standard lead free curve is set at 245☌ as highest temperature This delta T depends on the size of the board, the copper load of the board, the component load and size on the board etc… For a standard board this delta T will be around 25☌. Therefore the max temperature in the curve should be set at solder temperature of the alloy + a delta T on the board.
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